Intelligent Workflow for Design of RF PCB Applications

24 March 2022 12:30 - 13:10

IP integration within a larger mixed-signal PCB system is hampered by disjointed workflows between RF design and manufacturing layout design platforms. Overcoming cross-platform interoperability issues shortens turnaround times and eliminates potential design errors. This presentation will demonstrate using RF application examples the ways in which the design platforms by Cadence® supports effective RF-to-PCB workflow.

5 key learning points in this session:
1. RF design considerations and the importance of layout
2. EDA software capability
3. Reducing mistakes made in RF IP design exchange
4. Cutting edge tool integration
5. Thermal simulation consideration.

Andrew Wallace, Senior System Sales Executive, Cadence